past-events
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IMAPS-UK: MicroTech 2026 Conference
SouthamptonThe IMAPS-UK MicroTech 2026 Conference will focus on Driving Innovation in Semiconductor Packaging.
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IoTSF March Webinar
Webinar'Autonomous Compliance: Operationalising EU CRA and UK PSTI via Embedded Microservices' and 'Standards vs. Security: A Proactive Compliance Framework'
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Designing the Future: Analogue Mixed Signal (AMS)
Regents University London Inner Circle, Regent’s Park, LondonFollowing our first event on Digital SoC Design in November, this hands-on event brings together Analogue and Mixed Signal chip architects and designers to explore real-world pain points and application trends, sharing lessons learned.
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FPGA Frontrunners @ Microchip
Microchip 720 Wharfedale Rd, Winnersh, WokinghamGain insights from leading experts, learn how to meet functional safety and security requirements, network with industry peers and participate in discussions
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IoTSF Webinar: CRA Reporting Obligations with Mustanir Ali (Element)
What design choices can developers of embedded systems at the edge make right now to reduce the cost and pain of the compliance journey.
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How to move from Individual Contributor to Leader in a Male Dominated Environment: A Women in TechWorks Fireside Chat
WebinarEllie Bramer, Engineering Manager at Arm, discusses her own experience moving into leadership, and secondly what she looks for in high potential juniors
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Application-Specific Processors (ASIPs) for Physical AI
SpeakeA Synopsys Webinar with Dr. Falco Munsche, Technical Product Marketing, Synopsys and Prof. Hussam Amrouch, Technical University of Munich, Germany
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Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis
In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs
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Synopsys: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
With Dr. Lang Lin (Product Management, Principal, Synopsys). Dr. Lin isdirects product strategy for EDA solutions that ensure the multiphysics integrity, reliability, and security of advanced IC and multi die systems.
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Intel: Enabling and Evaluating Intel EMIB-T Bridging Design with Synopsys Tools
In this webinar, Intel will present how EMIB-T (Embedded Multi-die Interconnect Bridge with TSVs) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs.
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AESIN Webinar: ADAS Fit for the Future
WebinarWith Stephen Waldron of Vector GB Limited discussing how ADAS is transforming the way we interact with our cars shape the future of autonomy.
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