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This article covers how Siemens built their agentic architecture, why they built it in the sequence they did and what they announced at DAC 2026: self-verifying, long-running EDA AI agents for semiconductor and PCB design, in collaboration with NVIDIA.

17 November 2026 | Cambridge

This event will look at the current state of the Chiplet landscape, helping delegates understand the challenges and opportunities of this new approach to semiconductor product delivery and the role the UK will play in that.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a strategic step forward to expand its portfolio for software-defined vehicles (SDV) as well as other software-defined (SDX) and Physical AI applications.

Infineon Technologies AG is establishing the world’s first high-volume manufacturing facility for next-generation gallium nitride (GaN) power semiconductors on 300-millimeter wafers in Europe.

Cadence (Nasdaq: CDNS) today announced the Maestro™ AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

The company’s L-Series timing devices are designed to scale between COTS and traditional space-grade solutions, offering shorter lead times at competitive price points