past-events
Events for April 30, 2026
Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis
In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs
Synopsys: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
With Dr. Lang Lin (Product Management, Principal, Synopsys). Dr. Lin isdirects product strategy for EDA solutions that ensure the multiphysics integrity, reliability, and security of advanced IC and multi die systems.







