Presentation: Medium volume production and advanced packaging in the UK

Biography

John has over 47 years’ experience working in semiconductor packaging and electronics assembly technology, of which all has been in industry. Starting in STC Paignton in 1978 in their Optoelectronic Division as a process engineer, he then joined Custom Interconnect Ltd (CIL) in 1989, where he remains after 37 years. The first 6 years spent as a Design Engineer and Technical Manager on semiconductor packaging / complex PCBA’s and in 1995 he became Operations Director and Managing Director in 2001. In 2023, CIL opened its BP2 facility, which is the UK’s largest OSAT facility, resulting in CIL trebling in size.