TechWorks Semiconductors to Systems Summit   |   26th August 2026

Build: Materials, Manufacturing & Devices

Hosted by NMI   |   Sponsored by VAT and ZEISS

From novel materials to advanced packaging and metrology, we explored the full semiconductor value chain to see how innovation was enabling the next generation of devices. Materials science, equipment development, process engineering, packaging, and test were all in scope.

As traditional scaling slowed, heterogeneous integration, new materials and smart manufacturing were driving development through AI-driven design and process optimisation. We learned how foundational advances were unlocking new capabilities and future opportunities.

Highlights of the S2S26 Summit 2026

Over 700 industry leaders came together as TechWorks marked its 30th anniversary with the first Semiconductors to Systems Summit where leaders spanning semiconductors, electronic systems, cybersecurity, academia, government and investment.

John Brotherhood, Senior Principal Robotics Specialist, Amentum

John Moylan MBA, Operations Senior Manager, Vishay Newport Limited

Caroline O’Brien, CEO, CSA Catapult

Katie Hore, Innovation Director, REWIRE

Daniel Murphy, Snr Dir. Product Management, Cambridge GaN Devices

Dr Simon Thomas, CEO, Paragraf

Andrew Elliott, Business Development Lead, Carl Zeiss Ltd

Hannah Boardman, Dir. of Frontier & Early-Stage Technologies, DBIST

John Boston, Managing Director, Custom Interconnect Limited

Ibrahim Sari, AD, Semi. Systems & Integration, Uni. of Southampton

Derek McAulay, Design Engineering Architect, Cadence

Daniel Picado, President – Protection Division, Bourns

Paul Williamson, SVP Corporate Ventures, Arm

Charles Sturman, CEO, TechWorks

Jillian Hughes, Founder, WITW & Dir. of Ops, Silicon Catalyst EU