Full Summit Agenda
Explore the whole summit by clicking through each track below
Build: Materials, Manufacturing & Devices (hosted by NMI)
Sponsored by VAT and ZEISS
From novel materials to advanced packaging and metrology, we explore the full semiconductor value chain to see how innovation is enabling the next generation of devices. Materials science, equipment development, process engineering, packaging, and test are all in scope.
As traditional scaling slows, heterogeneous integration, new materials and smart manufacturing are driving development through AI-driven design and process optimisation. Join us to learn how foundational advances are unlocking new capabilities and future opportunities.
| Time | Session |
|---|---|
| 08:00 | Registration |
| 08:45 | Plenary Opening keynotes from industry leaders and government stakeholders in the main auditorium. The opening session will be beamed across all rooms. Individual track programmes will commence after this. |
| 09:15 | Gold track sponsor address by VAT and ZEISS Venothan Naidoo, Head of Marketing and Business Development – UK & Ireland, Carl Zeiss Limited John O’Donnell, Global Account Manager– Semiconductor IDMs, VAT Group. Followed by an introduction from Charles Sturman, CEO, TechWorks |
| Keynote Caroline O’Brien, CEO, CSA Catapult |
|
| Materials Innovation Hosted by John Lincoln, CEO, Photonics Leadership Group From wide bandgap to photonics, hear about world leading materials innovation |
|
| REWIRE – The next generation of power semiconductors: from concept to commercialisation Katie Hore, Innovation Director, REWIRE and Peter Gammon, Professor of Power Electronic Devices, University of Warwick |
|
| Photonics Materials Jon Heffernan, Prof. Semiconductor Materials and Devices, Sheffield University |
|
| ICeGaN® A scalable platform for the next generation of power systems Daniel Murphy, Senior Director Product Management, Cambridge GaN Devices |
|
| Panel Discussion | |
| 10:50 | Networking Break in the Exhibition Hall |
| 11:30 | Materials to Manufacturing Hosted by Nitin Dahad, Executive Editor, EE Times Translating materials into manufacturable processes, achieving scale and yield |
| Dr Simon Thomas, CEO, Paragraf | |
| Advancing Semiconductor Sustainability with Low-Carbon Integrated Circuits Technology Dr Feras Alkhalil, Vice President of Research and Development, Pragmatic Semiconductor |
|
| Ian Croston, VP Operations, Lumentum | |
| John Tingay, CTO, Oxford Instruments Plasma Technology | |
| Panel Discussion | |
| 13:00 | Networking Lunch in the Exhibition Hall |
| 14:10 | Process Control & Metrology: Measuring the Invisible Hosted by Gareth Edwards, Head of Sector for semiconductors and microelectronics, NPL Measuring nanoscale features and defects, failure analysis and ensuring yield and reliability |
| Automated Metrology for Semiconductors Andrew Elliott, Business Development Lead, Carl Zeiss Ltd |
|
| AI Can Find Defects. Can It Explain Them? Suzanne Costello, Founder & CEO – Forensic Eyes Ltd |
|
| Intelligent Manufacturing How are device manufacturers maintaining efficient and cost effective operations through intelligent systems and processes? |
|
| John Moylan MBA, Operations Senior Manager, Vishay Newport Limited | |
| From Static Capacity Model to Dynamic Capacity Planning: Deployment case study at Diodes Dennis Xenos, CTPO, Flexciton |
|
| Panel Discussion | |
| 15:40 | Networking Break in the Exhibition Hall |
| 16:20 | Advanced Packaging & System Optimisation Hosted by Steve Riches, Secretariat, IMAPS-UK Exploring the future of device packaging, heterogenous integration and system co-optimisation. |
| Steve Riches, Secretariat, IMAPS-UK | |
| Medium volume production and advanced packaging in the UK John Boston, Managing Director, Custom Interconnect Limited |
|
| Prof. Derrick Holliday, Director, NASPIC | |
| From Virtual Prototypes to Chiplet Platforms: Engineering the Future of Automotive Compute Katayoon Basharkhah, Researcher, imec |
|
| Accelerating Chiplet SoC Development with Standards-Based Frameworks and Automated Design Flows Derek McAulay, Design Engineering Architect, Cadence |
|
| Panel Discussion | |
| 17:55 | Closing Remarks |
| 18:00 | Evening Reception |
Create: Systems, Integration & Verification (hosted by AESIN & DESN)
Sponsored by NXP
The Create two cross-sector sessions focussing on systems innovation and trends, real-world deployments. The focus will be on the transition to software-defined products, HW–SW co-design and verification, the growing role of AI, automation and robotics in enabling more intelligent systems, alongside continued innovation in power systems and electrification. There will be a focus on functional safety from semiconductor through to system level. We will be highlighting the integration of AI into the design flow, and the expanding role of modelling, simulation and verification in reducing deployment risk. We will consider resilient positioning, navigation and timing (PNT) as a key enabler for reliable real-world operation across sectors.
| Time | Session |
|---|---|
| 08:00 | Registration |
| 08:45 | Plenary Opening keynotes from industry leaders and government stakeholders in the main auditorium. The opening session will be beamed across all rooms. Individual track programmes will commence after this. |
| 09:15 | Gold track sponsor address by NXP Followed by an introduction from Charles Sturman, CEO, TechWorks |
| Keynote Ian Constance, CEO, Advanced Propulsion Centre UK |
|
| Software Defined Product Hosted by Angad Jessel, Automotive Trends Analyst, Advanced Propulsion Centre UK How the software value-chain and lifecycle is driving the future of complex system based products. |
|
| Bringing Physical AI into the Real World Robert Moran, SVP & GM Automotive Processors, NXP Semiconductors |
|
| Brendan Morris, Senior Technical Marketing Engineer, Siemens Digital Industries Software | |
| From SDV to AIDV, what will Automotive Engineering look like tomorrow? Steve Waldron, Local Business Unit Manager, Vector GB |
|
| Session Q&A | |
| System Security and Resilience Hosted by Prof. Siraj Shaikh, Swansea University |
|
| Prof. Hafiz Malik, Professor and CECS Associate Dean of Graduate Education and Research, University of Michigan | |
| Saket Mohan, Founder & CEO, Secure Elements | |
| Sergio Scabar, Engineering Manager, JCB | |
| Session Q&A | |
| 10:50 | Networking Break in the Exhibition Hall |
| 11:30 | Advances in System on Chip Unpacking the breakneck rate of change in design and verification of System-on-Chip devices, and the increasing dependence on AI Session hosted by Amar Abid-Ali, CEO, Novomorphic |
| Tim Mamtora, COO, Raspberry Pi | |
| From Assistants to Autonomous Agents: The Evolution of AI in Chip Design Asi Sapir, Applications Engineering, Sr Architect, Synopsys |
|
| Evolution of Silicon Design Mrudula Gore, Senior Director, GPU Hardware Design, Imagination Technologies |
|
| Can We Trust the Chips in Our Cars? Verification as the Foundation of Safe Automotive Silicon Abinaya Senthil, Design Verification, NXP Semiconductors |
|
| From Prompt to Product: Generative Design for Embedded Systems That Scale Mark Lippett, CEO & President, XMOS |
|
| Session A&A | |
| Applications for resilient positioning, navigation and timing (PNT) Keynote and Hosted by Prof. Douglas Paul, Semiconductor Devices, University of Glasgow Exploring the recent advances in PNT and diverse cross-sector applications, before looking forward to the future opportunities for PNT post-quantum. |
|
| Chester Butterworth, Head of Strategy, Disruptive Capabilities and Technologies Office, Royal Navy | |
| John Brotherhood, Senior Principal Robotics Specialist, Amentum | |
| Fireside Chat | |
| 13:00 | Networking Lunch in the Exhibition Hall |
| 14:10 | AI, Automation & Robotics Hosted by Prof. Valentina Donzella, Sensors and Perception for Intelligent Systems, Queen Mary University of London Assessing the impact of cross-sector automation, AI, connectivity and the challenges of moving to intelligent autonomous systems. |
| Tim Edwards, Senior Research Manager, Jaguar Land Rover | |
| Edwin Herrera Alarcón, Autonomous Systems Specialist, Leonardo | |
| Dr Ketao Zhang, Reader (Associate Professor), Queen Mary, University of London (QMUL) | |
| Elena Voinea, Senior software engineer, IPG Automotive UK | |
| Digital Twins to AI-Enabled Autonomy: Keeping Humans at the Centre of Integrated Systems Deepaa Ganesh, Fellow, QinetiQ, UK |
|
| Session Q&A | |
| 15:40 | Networking Break in the Exhibition Hall |
| 16:20 | AV2G – Moving Power Hosted by Matthew Knight, Principal Technical Specialist, Cenex. We review the impact of cross-sector electrification, driven by the advances and increasing maturity in SiC and GaN technologies, we consider the full supply chain from wafer to application across opportunities in automotive, avionics, maritime, energy and charging infrastructure. |
| Daniel Turner, CPO, TOGL Energy | |
| Paolo Bargiacchi, Director, Product and Strategy, Motion Applied | |
| Richard Gordon, Project Director, Electrification, Ricardo | |
| Praneet Bhatnagar, Product Marketing Engineer, Vishay | |
| Session Q&A | |
| Functional Safety – from semiconductor to systems Hosted by Dr David Ward, Operations Director, MISRA As complex systems become more connected, more intelligent and more autonomous, how do we ensure functional safety, software standards and cross-sector compliance. |
|
| David Higham, Vice President of Functional Safety, Codasip | |
| Andrew Banks, Technical Specialist, LDRA | |
| Session Q&A | |
| 17:55 | Closing Remarks |
| 18:00 | Evening Reception |
Scale: Investing in the future of UK semiconductors (Hosted: UKSC)
Sponsored by UK Semiconductor Centre
With the UK facing a unique opportunity to grab a significant piece of the rapidly expanding global semiconductor market, access to capital and strong international partnerships will be critical to any success.
This track, organised by the UK Semiconductor Centre, will explore how we better connect investors with high-potential semiconductor businesses, strengthen pathways to scale-up, and build deeper partnerships with international governments and global industry leaders.
| Time | Session |
|---|---|
| 08:00 | Registration |
| 08:45 | Plenary Opening keynotes from industry leaders and government stakeholders in the main auditorium. The opening session will be beamed across all rooms. Individual track programmes will commence after this. |
| 09:15 | Building a winning semiconductor company Welcome and introduction by Andy McLean (CEO, UKSC) Join founders, entrepreneurs and senior industry leaders as they share the lessons they’ve learned building semiconductor businesses—from securing investment and navigating growth challenges to expanding internationally and positioning for long-term success. |
| Keynote Stan Boland, Technology entrepreneur and investor |
|
| Keynote Phil Burr, Head of Product, Lumai |
|
| Panel Session Session Hosted by Andy McLean With Stan Boland, Phil Burr and Sean Redmond, President, Silicon Catalyst |
|
| 10:50 | Networking Break in the Exhibition Hall |
| 11:30 | Funding the future – navigating public and private funding Hosted by Martin O’Sullivan, Director of Investment, UKSC This session will explore how we better connect investors with high-potential semiconductor businesses and strengthen pathways to scale-up. Hear unique insights, advice and guidance from leading figures at public and private investment firms who are investing in future semiconductor technology. |
| Overview of the semiconductor investment landscape Martin O’Sullivan, Director of Investment, UKSC |
|
| Keynote Maxime Mallet, General Partner, Jolt Capital |
|
| Keynote Lee Thornton, Partner, IP Group |
|
| Keynote Ekaterina Almasque, Founding Partner, BlankPage Capital |
|
| Panel Session Chaired by Martin O’Sullivan. Panel: Lee Thornton, Maxime Mallet, Ekaterina Almasque and Russell Haggar, Managing Partner, Silicon Catalyst LLC |
|
| 13:00 | Networking Lunch in the Exhibition Hall |
| 14:10 | Why the UK? The multinational perspective on investing, innovating and growing in the UK Hosted by Brian Robertson, Director of International Partnerships, UKSC. This session will provide unique insights from multinational companies operating in the UK. We will explore how the UK can build deeper and more effective collaborations with global partners across industry, academia and government. What does success look like? Where will the most beneficial partnerships come from? And how do we make them meaningful and impactful? |
| Keynote Elizabeth Patterson, Senior Program and Policy Manager, Seagate Technology |
|
| Fireside Chat Chaired by Brian Robertson and including Elizabeth Patterson and others TBA |
|
| Building effective international partnerships Introduction by Charles Sturman, CEO, TechWorks Semiconductors are global, and the strongest ecosystems are built on international collaboration. Hear from leaders of semiconductor organisations across the world as they explore how the UK can work with international partners to accelerate innovation, strengthen supply chains, open new markets and develop the next generation of semiconductor technologies. |
|
| Panel Discussion Hosted by Charles Sturman. Panel: Paul Slaby (Managing Director, Canada’s Semiconductor Council), Valerie Pajak (Project Manager, High Tech Holland) and Andreas Lippert, COO Investor Services, Saxony Trade & Invest Corp. |
|
| 15:40 | Networking Break in the Exhibition Hall |
| 16:20 | The UK’s future in the global semiconductor value chain Hosted by Raj Gawera, COO, UKSC This session will explore the UK’s future role in a globally complex and competitive value chain. Where can we add the most value? How can partnerships advance our capability? And why should international investors and collaborators choose us? |
| Keynote Graham Curren, Founder & Former CEO, Sondrel |
|
| Keynote Rebecca Dobson, Technology executive, board advisor and industry leader |
|
| Keynote Themis Prodromakis, Regius Chair of Engineering, University of Edinburgh |
|
| Panel Session Hosted by Raj Gawera Panel: Graham Curren, Themis Prodromakis & others TBA |
|
| 17:55 | Closing Remarks Andy McLean, CEO, UKSC |
| 18:00 | Evening Reception |
Secure: Cyber Resilience, Trust & Quantum Safety (Hosted: IoTSF)
Sponsored by Green Hills Software
How do we secure the next generation of connected devices in an era of AI, evolving regulation and emerging cyber threats? Join industry experts at the 12th annual IoT Security Conference – a part of the TechWorks Semiconductors to Systems summit – to explore the latest thinking on cyber resilience, trusted devices, AI, quantum risk, compliance and secure-by-design strategies. Expect practical insights, expert perspectives and valuable networking with leaders shaping the future of secure IoT.
| Time | Session |
|---|---|
| 08:00 | Registration |
| 08:45 | Plenary Opening keynotes from industry leaders and government stakeholders in the main auditorium. The opening session will be beamed across all rooms. Individual track programmes will commence after this. |
| 09:15 | Gold track sponsor address by Green Hills Software Followed by an introduction from Chris Bennison, Operations Manager, IoT Security Foundation |
| Cyber risk, trust and resilience Explore strategies for managing cyber risk, strengthening resilience and building trust across increasingly connected IoT ecosystems in the face of evolving threats. |
|
| Keynote Hugo Vincent, Principal Security Architect (Researcher), Arm |
|
| Vibe coding for IoT and the pitfalls of AI Ken Munro, Managing Partner and Aaron Thacker, Hardware Security Consultant, Pen Test Partners |
|
| Why aren’t our enterprises secure from cyber-attacks? Jeremy Flann, Vice President, EMEA, Green Hills Software Ltd |
|
| Trust at AI Speed Florian Lukavsky, Chief Innovation Officer, SignPath |
|
| From Visibility to Verifiable Trust: Continuous IoT & OT Compliance in the Age of AI and Quantum Risk James Penney, Chief Technology Officer, Device Authority |
|
| 10:50 | Networking Break in the Exhibition Hall |
| 11:30 | Governance, regulation and emerging threats Understand the latest regulatory developments, compliance requirements and emerging cyber threats shaping the future of IoT security and resilience. |
| The Threat Model as Your Security Centrepiece Jonny Tyers, Managing Director, Threatplane |
|
| Secure Agentic AI, The Details Most Orgs Overlook Bill Bauman, Co-founder, NuDay AI |
|
| The Good, the Bad, and the Non-Compliant: Real-World Data from SafeShark’s Testing Frontlines Jonathan Marshall, Director, SafeShark |
|
| Preparing for the Quantum Era and the Age of AI Adam McElroy, Chief Technology Officer, Eclypses |
|
| CRA Panel: The Cyber Resilience Act: Turning regulation into reality Moderator: Richard Marshall, Managing Consultant, XITEX Ltd Panellists: David Pashley, Managing Director, Direct Insight Joe Lomako, Cyber Lead (IoT), TUV SUD John Boggie, Sr Director Security Business Development, NXP Semiconductors Mustanir Ali, Head of Cyber Product Assurance , Element Florian Lukavsky, Chief Innovation Officer, SignPath |
|
| 13:00 | Networking Lunch in the Exhibition Hall |
| 14:10 | Secure foundations and trusted infrastructure Discover how secure hardware, trusted architectures and resilient infrastructure provide the foundation for protecting connected devices and critical systems. |
| From Research to Deployment: CHERI, the CHERI Alliance and the Next Wave of Secure Computing Mike Eftimakis, Founding Director, CHERI Alliance |
|
| Trusted Foundations for Memory-Safe AI: Hardware-Enforced Cyber Resilience for Critical Infrastructure Haydn Povey,CEO and Co-founder, SCI Semiconductor |
|
| Building FPGA-Enabled Practical Secure Edge AI Systems Amar Abid-Ali, CEO, Novomorphic |
|
| Silicon Assurance and Tamper-Evident Supply Chains: Building Trust from Chip to Deployment Isabela Radulescu, COO, Ethicronics Ltd |
|
| Supply Chain Panel Moderator: Ras Attale, Co-Chair, Women in TechWorks and Senior Hardware Engineer, Siemens Panellists: Lee Harrison, Marketing Director, Siemens EDA, Siraj Shaikh, Professor, Swansea University Jennifer Williams, Managing Director, Secarma Ltd and a representative from NCSC |
|
| 15:40 | Networking Break in the Exhibition Hall |
| 16:20 | Quantum security and future readiness Prepare for the next era of cybersecurity by exploring post-quantum cryptography, crypto-agility and practical approaches to building quantum-ready IoT systems. |
| Adopting Post-Quantum Security and Memory Safety Best Practice Through Open Source Javier Orensanz Martinez, CEO, lowRISC |
|
| Post Quantum Tales from the Trenches Chris Swan, Engineer, Atsign |
|
| End-to-End Digital Assurance for Quantum Systems Stephen Powley, Senior Research Associate in Systems Security, Loughborough University |
|
| Achieving Crypto-Agility and Quantum-Safe Readiness Yang Sun, Customer Success Engineer, IBM |
|
| The Road to Quantum-Ready IoT: Building Trust in the Post-Quantum Era Mohit Arora, Sr Director, Architecture & Product Security, Synaptics |
|
| Keynote Dex Hunter-Torricke, Founder & President, The Center for Tomorrow |
|
| 17:55 | Closing Remarks Chris Bennison, Operations Manager,IoT Security Foundation |
| 18:00 | Evening Reception |
