Synopsys: UCIe – On-Package Chiplet Innovation Opportunities

High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc. On-package interconnects are a critical component to deliver the power-efficient performance for this evolving landscape.

Universal Chiplet Interconnect Express (UCIe), is an open industry standard with a fully specified stack that comprehends plug-and-play interoperability of chiplets on a package; In this webinar, we will discuss the usages, key metrics and the silicon health associated with different technology choices in UCIe and how it will evolve going forward. We will also delve into the challenges and opportunities for chiplets connected through UCIe, including production test, repair and in-field silicon lifecycle management.